BOOK OF SOLUTIONS

Catalogue designed to publicize the services, equipment and technologies of the centers that belong to the Spanish Cleanroom Network of Micro and Nano Manufacturing (Micronanofabs).

ICTS

Unique Science and Technology Infraestructures

MICRONANOFABS

Cleanroom Network of Micro and Nano Manufacturing

IMB-CNM, CSIC

Institute of Microelectronics of Barcelona

ISOM

Institute for Optoelectronic systems and Microtechnology

NTC

Nanophotonic Technology Center of Valencia

EQUIPMENT LIST

Micronanofabs Instalations

SERVICES

TECHNOLOGICAL LINES

Research lines

  • UNIQUE SCIENCE AND TECHNOLOGY INFRAESTRUCTURES (ICTS)

Unique Science and Technology Infrastructures (ICTS) are unique and exceptional facilities. They carry out top research of the highest quality, and act as centers for the transmission, exchange and preservation of knowledge, technology transfer and the promotion of innovation.

They are located throughout the country and are included in what is called the Map of Unique Scientific and Technical Infraestructure established every four years by the Ministerio de Ciencia, Innovación y Universidades.

They can be located in a single location (Single Location Infrastructures), they can be part of an Infrastructure Network (IN) or be constituted as a Distributed Infrastructure (DI), depending on the level of integration and coordination of their capabilities.

ICTS’s have three fundamental characteristics: they are publicly owned infrastructures, they are unique and they are open to competitive access.

Currently, Spain has 29 ICTS, totaling 64 infraestructures, which are crucial to the country’s current science and innovation project.

  • CLEANROOM NETWORK OF MICRO AND NANO MANUFACTURING (MICRONANOFABS)

    MICRONANOFABS

MICRONANOFABS is a distributed ICTS (Unique Science and Technology Infraestructure) dedicated to Micro and Nano Fabrication and Photonics. It serves as a large-scale experimentation infraestructure for engineering and the development of new technologies with applications in various fields, offering advanced technologies that provide essential and horizontal support across all disciplines of science and technology.

MICRONANOFABS mission is to support Spanish and Euopean reserach groups and industries in micro and nano fabrication for both miniaturized electronic devices, integrated photonic devices and systemns, enabling the integration of novel materials and devices (quantum, AI…).

MICRONANOFABS vision is to conform and sustain a comprehensive clean room network that integrates the compplete technological value chain of micro and nano electronics and photonics fabrication, strengthening the collaboration between research and industry, leveraging shared scientific knowledge and technological processes and offering training in the above-mentioned technologies.

Due to its horizontal nature, the benefits of the MICRONANOFABS Network’s offerings extend beyond the ICT or materials sectors, encompassing all industrial sectors and social challenges where miniaturized materials, electronic, and photonic components can play a crucial role. These include ares such as Health, Transportation, Energy, Enviroment, Food, Security, and more.

Micronanofabs has more than 2.000 m² of Clean Room space (class 10-100-1.000), available to the scientific community and industry, along with associated laboratories for the packaging and characterization of systems and devices. In recent years, thanks to European Regional Development Fund (ERDF), the equipment has been upgraded to process wafers with diameters of 150mm and 200 mm (6” and 8” respectively) to achieve new challenges.

The  MICRONANOFABS facilities are distributed across the following nodes:

Integrated Clean Room for Micro and Nano Fabrication at the National Microelectronics Center (SBCNM): This facility is part of the Spanish National Research Council (CSIC) and is managed as part of the Institute of Microelectronics of Barcelona, located in Bellaterra (Barcelona).

Technology Center at the Institute of Optoelectronic Systems and Microtechnology (CT- ISOM): This is a University Research Institute affiliated with the Polytechnic University of Madrid (UPM) and is located at the Higher Technical School of Telecommunications Engineering in Madrid.

Micro and Nano Fabrication Infraestructure at the Center for Nanophotonic Technology of Valencia (NF-NTC): This facility is part of the Polytechnic University of Valencia (UPV).

Each MICRONANOFABS node has unique features and complementary research lines in the fields of micro and nanotechnology, optoelectronics, photonics, and the characterization of devices and materials. To achieve this, the nodes coordinate to provide a comprehensive technological offering, operating in a distributed manner. The contracting of distributed services provides global access to the facilities, whether through a combined offering of technologies and equipment from two or three nodes, or through a single node.

MICRONANOFABS is part of the European nanofabrication network Euronanolab, which includes more than 40 cutting-edge academic nanofabrication centers across Europe. Its main objective is to accelerate research in the micro and nanotechnology sector by transforming a fragmented landscape of nanofabrication facilities into an integrated knowledge base that supports scientific excellence and provides researchers with a fast track to achieving results.

  • INSTITUTE OF MICROELECTRONICS OF BARCELONA (IMB-CNM, CSIC)

    IMB-CNM, CSIC

The Institute of Microelectronics of Barcelona (IMB-CNM) serves as the headquarters of the National Microelectronics Center in Barcelona. The Institute has been part of the Consejo Superior de Investigaciones Científicas (CSIC) since its inception and hosts the Integrated Clean Room for Micro and Nano Fabrication, covering 1,500 m²with class 100–10,000 standards. Its main areas of activity focus on Micro and Nanoelectronics, Sensors, Actuators, and MEMS, addressing both the design and fabrication aspects of devices, circuits, and systems.

The IMB-CNM is located in Bellaterra (Cerdanyola del Vallès) on the campus of the Autonomous University of Barcelona (UAB).

The Integrated Clean Room for Micro and Nano Fabrication (SBCNM) is an open-access ICTS dedicated to the development and application of innovative technologies in the field of Microelectronics, along with other emerging Micro and Nanotechnologies. Its mission is to support national and international research groups in carrying out R&D&I activities. The facility includes equipment for micro and nanofabrication processes, primarily based on silicon technologies for wafers of 100 mm and 150 mm in diameter. However, it can also accommodate substrates made of different materials and sizes based on demand. Its structure allows for flexible operation, making it particularly suitable for R&D&I.

The facility is certified with the ISO 9001:2015 Quality Management System for its microelectronic device fabrication activities.

THE FACILITIES CAN BE EXPLORED THROUGH THIS VIRTUAL TOUR

  • INSTITUTE FOR OPTOELECTRONIC SYSTEMS AND MICROTECHNOLOGY

    ISOM

The Institute for Optoelectronic Systems and Microtechnology (ISOM) is a university research institute affiliated with the Polytechnic University of Madrid (UPM). It was established based on an initial proposal from several research groups belonging to the Departments of Electronic Engineering, Photonic Technology, Applied Physics to Information Technologies, and Applied Physics to Architecture, Urban Planning, and the Environment.

The ISOM is located at the Higher Technical School of Telecommunications Engineering of the UPM. It features 300 m² of characterization laboratories with centralized air conditioning and 200 m² of instrumentation and electronics laboratories.

The ISOM Clean Room for Micro and Nanofabrication spans 400 m², divided into various areas, representing a significant step forward in achieving the goal of conducting cutting-edge research in nanomaterials, devices, and systems. This is accomplished through lifelong learning, excellence in research, and successful innovation, with a strong commitment to serving the industrial ecosystem in the field of microelectronics and the scientific community. All this is fostered within a creative and proactive environment.

  • NANOPHOTONICS TECHNOLOGY CENTER

    NTC

The Nanophotonics Technology Center of Valencia (NTC) is a University Research Institute at the Polytechnic University of Valencia (UPV), with a strong focus on technology transfer to industry and the development of nanotechnology and nanoscience. It has a multidisciplinary nature: on one hand, it offers its expertise in the fabrication of photonic materials and devices (e.g., silicon photonic integrated circuits, silicon nitride circuits, and other types of substrates). On the other hand, it provides micro/nanofabrication services to industries from other economic sectors where nanotechnologies enable a wide range of applications.

The NTC Clean Room covers 500 m² (class 10-100-10,000) and features a complete production line for micro/nanofabrication on silicon substrates and other materials. It accommodates all kind of samples, from dies to wafers with a diameter of 200 mm, using CMOS-compatible technologies that enable the fabrication of both photonic and electronic integrated circuits. The facility is managed by a team of highly experienced process and equipment engineers who specialize in developing and optimizing the necessary fabrication processes as well as operating and maintaining state-of-the-art equipment. Additionally, it has several research laboratories for the characterization, assembly, and packaging of fabricated devices.

The NTC Clean Room has been certified by TüV, the German standards body, to comply with ISO-4, ISO-5, ISO-6, and ISO-7 classes according to the ISO-14644 standard.

THE FACILITIES CAN BE EXPLORED THROUGH THIS VIRTUAL TOUR

  • LIST OF EQUIPMENT

Currently, the facilities of Micronanofabs consist of more than 230 equipments divided into four categories:

Processing Techniques

  Metallization
  Thermal processes and CVD
  Ionic implantation
  Photolitography
  Nanolitography
  Dry and wet etching
  Microsystems

Device, Circuit and System Characterization

  Electrical characterization
  Optical characterization
  Optoelectronics characterization
  Magnetics characterization
  Physics characterization

Material Growth

  Molecular-beam epitaxy (MBE Growth)

Packaging and Integration

  Wafer dicing
  Packaging
  Photonics Packaging
  Reverse engineering and reliability
  Electronic circuits and systems integration

The number of equipment has increased due to technological advances and developments in the microelectronics sector. With these improvements in facilities and equipment, the goal is to enhance the capabilities of Micronanofabs to contribute to the development of the micro and nanofabrication and photonics sectors.

HIGHLIGHTED EQUIPMENT OF MICRONANOFABS

Molecular Beam Epitaxy (MBE) equipment

For III-V semiconductor materials arehighly specialized tools for growing thin, high-quality crystalline layers with atomicprecision. The ability of MBE to control the composition, thickness, and doping ofsemiconductor films at the atomic level makes it indispensable for the fabrication ofsemiconductor materials and devices based on GaAs, GaN, AlGaAs, InP with varyingdoping levels.

IBS 210RD Ion Implanter

Enables surface doping of semiconductors. This processoffers multiple advantages, such as precise control over the doping depth profilewith excellent uniformity. Additionally, it is a low-temperature process thataccommodates a wide range of masking materials, including resin, oxide, polysilicon,or metal.

NanoFrazor

NanoFrazor (Heidelberg Instruments) is a state-of-the-art nanofabrication tool thatoffers unparalleled precision, real-time control, and 3D patterning capabilities. At itscore, it features an ultra-sharp, heated probe that simultaneously writes and inspectscomplex nanometric structures. The Direct Laser Sublimation (DLS) module enablesthe efficient writing of nano- and microstructures on the same resin layer in a singlefabrication step.

100keV jbx-8100FS Electron Lithography System

Defines ultra-fine patterns (5 nm)at higher speeds and minimizes downtime, especially during the exposure process,which boosts throughput. The system features substrate cassettes for small pieces,wafers ranging from 100 mm to 200 mm, and includes an automatic loader with 12positions. It offers two writing modes: High Resolution (with writing fields of 100microns) and High Performance (with writing fields of 1 mm).

NSR 2205i12D i-line Stepper

Is a high-precision photolithography system with acritical dimension of down to 350 nm, featuring a maximum exposure area range of22x22 mm² on 100 mm and 150 mm wafers.

Atomic Force Microscope (AFM)

Is a highly versatile tool due to its threeindependent heads: FastScan, designed for capturing surface images at thenanoscale with high resolution and ultra-fast speed; the standard BrukerDimension Icon; and the Bruker Dimension Icon with MFM module, for studyingmagnetic properties at the nanoscale.

  • SERVICES

When requesting a service, access is granted to the facilities provided by each of the three nodes collectively (access to combined technology or facilities from two or more nodes) or to a single unit (access to the technology and/or facilities of one node). These services can be requested by researchers from the public or private sector, both nationally and internationally.

To submit a request, the following steps must be followed:

  • Review the available services on the Micronanofabs website
  • Read the access protocol
  • Fill out the application form

    WORK REQUEST

  • Receive approval from the Access Committee
  • Wait for contact from Micronanofabs to confirm timelines and define processes and budgets
  • Submit the fabricated sample and proceed with payment

The wafers that can be processed at the facilities vary in diameter depending on their intended purpose and the area in which they are used. With this in mind, the following sizes are worked with: 100 mm (4″) , 150 mm (6″) , 200 mm (8″) . Additionally, chip samples can also be processed directly.

The available services are grouped into the work areas available at Micronanofabs. The full list is as follows:

PROCESSING TECHNIQUES

Thermal Processes and CV

Techniques that require the use of high temperatures at atmospheric pressure or ina vacuum for the deposition of dielectric or polysilicon layers include:

  • Thermal Oxidation of Silicon
  • Diffusion and Annealing Processes
  • Rapid Thermal Processing (RTP)
  • Low Pressure Chemical Vapor Deposition (LPCVD)
  • Plasma-Enhanced Chemical Vapor Deposition (PECVD)
  • Atomic Layer Deposition (ALD, PEALD)
Ionic Implantation

Techniques used in the semiconductor industry to introduce ions into the surface ofwafers and modify their conductivity include:

  • Surface Doping with Different Atomic Species (B, P, As, N, Al, Si, Mg, O, He)
Dry Etching

Plasma etching techniques for various materials include:

 

  • Reactive Ion Etching (RIE, ICP-RIE)
  • Deep Reactive Ion Etching (DeepRIE) Systems
  • Photoresist Etching
  • Argon Ion Milling
  • Oxigen Plasma
Metalization

The film deposition techniques for various metallic materials include:

  • Physical Vapor Deposition (PDV) in Cathodic Sputtering Systems de (DC and RF)
  • Physical Vapor Deposition (PVD) in Thermal Evaporation or Electron Beam Systems
  • Joule Evaporation Deposition
  • Electrodeposition
Wet Etching

Specific etching techniques for materials in liquid enviroments include:

  • Isotropic Wet Etching of Metals and Dielectrics
  • Lift-off
  • Wafer Bonding
  • Wafer Surface Cleaning
  • Wet Photoresist Stripping
Lithography

Techniques for pattern transfer from a mask to a substrate with micro or submicron resolution, and for characterizing materials, processes, and devices fabricated at the nanoscale, include:

  • Proximity or Contact Lithography
  • Projection Lithography
  • Direct Laser Lithography
  • Electron Beam Lithography (EBL)
  • AFM-based Nanofabrication
  • Nanoimprint Lithography
  • Focused Ion Beam (FIB)
  • Scanning Electron Microscopy (SEM)
  • Resist Processing
  • Optical Microscopy (OM)
  • Mask Design
  • Contact Fabrication by Air Bridges

MATERIAL GROWTH

Molecular-Bem Epitaxy (MBE Growth)

A highly specialized technique for the growth of thin, high-quality crystalline layerswith atomic precision. With this technique, it is possible to control the composition,thickness, and doping of semiconductor films at the atomic level, allowing for thegrowth of films of GaAs, GaN, AlGaAs, InP with various doping levels.

  • Molecular Beam Epitaxy (MBE) for Semiconductors12

DEVICE CHARACTERIZATION

CHARACTERIZATION

Part of the post-processing responsible for monitoring processes, evaluating, andconducting quality studies of fabricated devices includes:

  • Optical Microscopy
  • Device Preparation
  • Spectral Reflectance
  • Spectral Ellipsometry
  • 3D Optical Profilometry
  • Mechanical Profilometry
  • Fourier Transform Infrared Spectroscopy (FT-IR)
  • Raman Spectroscopy
  • Near-field Scanning Optical Microscopy (SNOM)
  • L-I curves in UV-VIS-IR lasers
  • Hall Effect Measurement
  • Thickness Measurement in Thin Films and Surface Measurement
  • Sheet Resistance Measurement
  • Curvature and Thickness Measurement
  • Lifetime Measurement
  • Photoluminiscence Measurement (IR-VIS-UV)
  • Electroluminiscnce Measurement
  • Resistivity Measurement
  • Spectral Response Measurement of Detectors
  • Laser Emission Spectral Measurement
  • Luminiscence Emission Spectral Measurement
  • Hysteresis Cycle
  • Parametric Test
  • Design and Characterization of Test Structures
  • Setup of New Measurement Techniques on Wafers
  • Electronic Device Characterization
  • Optoelectronic Characterization
  • Electrical and Magnetic Characterization
  • SEM Microscopy Characterization

PACKAGING AND INTEGRATION

Packaging

A series of techniques used to encapsulate the semiconductor device in a ceramicpackage to protect it from physical damage include:

  • Adhesion and Dicing of Silicon Wafers and Substrates fron Various Materials
  • Polishing
  • Soldering
  • Epoxy Adhesive Dispensing
  • Wirebonding
  • Ribbon bonding
  • Flip Chip
Integración

Final tests to verify the proper functioning of the device’s systems include:

  • Destructive or Non-Destructive Testing
  • Connection Bonding Test
  • Soldering Test via Shear Test
  • TECHNOLOGICAL LINES

The devices created at MICRONANOFABS are made possible thanks to the research carried out at the three nodes that make it up and the internal collaboration. Behind each device is technical and research personnel grouped into research lines to improve their capabilities and ensure proper functionality.

Thanks to these investigations, it is possible to offer innovative devices both to companies and research projects.

Thanks to these investigations, it is possible to offer innovative devices both to companies and research projects. The research lines, which group all the manufactured devices, are as follows:

Energy and Mobility

It seeks solutions to the challenges of the energy transition. Power semiconductor devices, converters, and reliable and efficient electronic systems, or devices for energy harvesting at the microscale, are developed. Research is conducted on autonomous energy systems, emission-free mobility, and the implementation of smart grids. These activities influence all aspects of the electrical energy value chain, including generation and storage, energy conversion, and efficient and reliable use.

Technology and Advanced Processes for Micro and Nanosystems

Transversal micro and nanofabrication technologies are developed as a technological platform based on silicon nitride for the fabrication of integrated photonic circuits, resistive switching devices for the development of RRAM memory cells and memristors, or nanoelectronic devices such as single-electron transistors.

Nanophotonics for Energy

Development, design, and fabrication of artificial materials and metasurfaces based on complex electromagnetic structures, new epitaxial growth methods, integrated graphene photonic platforms on Si or SiN, novel nanomaterials for photonics and photovoltaics, and hybrid devices on dielectric substrates and SERS membranes. Additionally, nanotechnologies are used to produce nanoparticles or quantum dots.

Physics and Civil Security

Pwer devices and radiation sensors are developed to operate in hostile environments (high temperature, radioactive environments, etc.) for applications in particle physics, nuclear physics, synchrotron and nuclear fusion facilities, space applications, instrumentation for civil security, and societal challenges.

Nanophotonics for Health Care and Biosensing

Development of biosensors and photonic systems for medical applications or food quality control across various technologies including SOI (Silicon on Insulator), silicon nitride, and porous oxides. The photonic structures used as transducers include resonant rings, Fabry-Perot structures, corrugated waveguides, and photonic crystals.

Green Energy and Enviroment

Area focused on changes in sustainable technology with innovations in solar cells, solid-state lighting, supercapacitors, and permanent magnets. The goal is to push the efficiency limits with next-generation solar cells, advanced III-nitride LEDs, and energy storage with graphene-based supercapacitors.

Information and Comunications

It addresses challenges in quantum communications, spintronic devices, storage technologies, and electronics for mobile communications and sensors. Compact single-photon devices and magnetic nanodevices are developed. Additionally, the future of mobile communications and sensors is driven by advanced surface acoustic wave filters.

Health and Enviroment

Monitoring tools are developed with the latest advances in micro-nano technologies. They cover applications ranging from single-cell analysis to environmental monitoring. For example, chips that detect and act on living cells, advanced optomechanical sensors, neural interfaces, medical imaging and dosimetry, tools for measuring chemical parameters in liquid fluids, lab-on-chip, environmental harvesting (thermoelectricity), and generation/storage (micro fuel cells/biodegradable batteries).

Nanophotonics for Communications

The circuits manufactured include siliconoptical switches and modulators, as well as integrated circuits with unique optical properties to enhance electro-optical and all-optical functionalities. They also cover areas such as Plasmonics, Optomechanics, and Chiral Photonics, aiming to develop ultracompact microwave devices.

Nanomaterials for Emerging Applications

Science at the nanometer scale is led in innovative scenarios with nanobiomedical, plasmonic, metamaterials applications, and multi-scale simulations, based on the development of optical biosensors using transparent conductive oxides or graphene-based sensors for biomedical advancements and research on oxide-based metasurfaces. Additionally, simulations connect atomic structures with the macroscopic properties of custom-designed materials.