SERVICES
When requesting a MICRONANOFABS service you will be granted access to the facilities provided by each of the three nodes as a whole (access to combined technology or facilities of two or more access nodes) or to a single unit (access to the technology and/or facilities of a single node).
You can request access to the MICRONANOFABS network through this form.
- PROCESSING TECHNIQUES
THERMAL PROCESSES AND CVD
Techniques that require the use of high temperatures at atmospheric pressure or in a vacuum for the deposition of dielectric or polysilicon layers include:
- Thermal Oxidation os Silicon
- Diffusion and Annealing Processes
- Rapid Thermal Processing (RTP)
- Low Pressure Chemical Vapor Deposition (LPCVD)
- Plasma-Enhanced Chemical Vapor Deposition (PECVD)
- Atomic Layer Deposition (ALD, PEALD)
IONIC IMPLANTATION
Techniques used in the semiconductor industry to introduce ions into the surface of wafers and modify their conductivity include:
- Surface Doping with Different Atomic Species (B, P, As, N, Al, Si, Mg, O, He)
DRY ETCHING
Plasma etching techniques for various materials include:
- Reactive Ion Etching (RIE, ICP-RIE)
- Deep Reactive Ion Etching (DeepRIE) Systems
- Photoresist Etching
- Argon Ion Milling
- Oxigen Plasma
METALIZACIÓN
Thin film deposition techniques for various metallic materials include:
- Physical Vapor Deposition (PVD) in Cathodic Sputtering Systems (DC and RF)
- Physical Vapor Deposition (PVD) in Thermal Evaporation or Electron Beam Systems
- Joule Evaporation Deposition
- Electrodeposition
WET ETCHING
Specific etching techniques for materials in liquid environments include:
- Isotropic Wet Etching of Metals and Dielectrics
- Lift-off
- Wafer Bonding
- Wafer Surface Cleaning
- Wet Photoresist Stripping
LITHOGRAPHY
Techniques for pattern transfer from a mask to a substrate with micro or submicron resolution, and for characterizing materials, processes, and devices fabricated at the nanoscale, include:
- Proximity or Contact Lithography
- Projection Lithography
- Direct Laser Lithography
- Electron Beam Lithography (EBL)
- AFM-based Nanofabrication
- Nanoimprint Lithography
- Focused Ion Beam (FIB)
- Scanning Electron Microscopy (SEM)
- Resist Processing
- Optical Microscopy (OM)
- Mask Design
- Contact Fabrication by Air Bridges
- MATERIAL GROWTH
MOLECULAR-BEAM EPITAXY (MBE)
A highly specialized technique for the growth of thin, high-quality crystalline layers with atomic precision. With this technique, it is possible to control the composition, thickness, and doping of semiconductor films at the atomic level, allowing for the growth of films of GaAs, GaN, AlGaAs, InP with various doping levels.
- Molecular Beam Epitaxy (MBE) for Semiconductors
- DEVICE CHARACTERIZATION
CHARACTERIZATION
Part of the post-processing responsible for monitoring processes, evaluating, and conducting quality studies of fabricated devices includes:
- Optical Microscopy
- Device Preparation
- Spectral Reflectance
- Spectral Ellipsometry
- 3D Optical Profilometry
- Mechanical Profilometry
- Fourier Transform Infrared Spectroscopy (FT-IR)
- Raman Spectroscopy
- Near-field Scanning Optical Microscopy (SNOM)
- L-I Curves in UV-VIS-IR Lasers
- Hall Effect Measurement
- Thickness Measurement in Thin Films and Surface Measurement
- Sheet Resistance Measurement
- Curvature and Thickness Measurement
- Lifetime Measurement
- Photoluminescence Measurement (IR-VIS-UV)
- Electroluminescence Measurement
- Resistivity Measurement
- Spectral Response Measurement of Detectors
- Laser Emission Spectral Measurement
- Luminescence Emission Spectral Measurement
- Hysteresis Cycle
- Parametric Test
- Design and Characterization of Test Structures
- Setup of New Measurement Techniques on Wafers
- Electronic Device Characterization
- Optoelectronic Characterization
- Electrical and Magnetic Characterization
- SEM Microscopy Characterization
- PACKAGING AND INTEGRATION
PACKAGING
A series of techniques used to encapsulate the semiconductor device in a ceramicpackage to protect it from physical damage include:
- Adhesion and Dicing of Silicon Wafers and Substrates from Various Materials
- Polishing
- Soldering
- Epoxy Adhesive Dispensing
- Wirebonding
- Ribbon bonding
- Flip Chip
INTEGRATION
Final tests to verify the proper functioning of the device’s system include:
- Destructive or Non-Destructive Testing
- Connection Bonding Test
- Soldering Test via Shear Test